Categories: Google

Challenging Apple! Google’s self-developed SoC Tensor G5 enters tape-out phase

 looking at the major giants in the current mobile phone market, without exception, they all have their own Soc chips. It is natural for the leading company Google to move towards manufacturing SoCs.

Starting from the Pixel 6 series, Pixel models are equipped with Google’s customized Tensor chip, which is a modified version of Samsung’s Exynos. Only the TPU, ISP and the matching Titan M2 security chip are Google’s own technologies.

But starting with Tensor G5, Google will achieve complete self-developed chips. According to reports, Tensor G5 will be manufactured by TSMC using a 3nm process and has now entered the tape-out stage.

The so-called tape-out is to manufacture chips through a series of process steps like an assembly line. This link is in the middle stage between chip design and chip mass production and is a key link in chip manufacturing.

If the tape-out is successful, the chips can be manufactured on a large scale based on it; otherwise, it is necessary to find out the reasons and carry out corresponding optimization design.

According to the plan, Google Tensor G5 will officially debut next year and will be first installed in the Pixel 10 series.

Analysts said that Tensor G5 is an important milestone for Google, representing a major breakthrough for Google Pixel in the field of mobile phone hardware. It will also challenge the iPhone, which will be a key step for Google to compete for the high-end market.

Share
Published by
Kazam

Recent Posts

9 things you should know about the iPhone Ultra

Multiple sources indicate that Apple will officially release its first foldable iPhone, tentatively named iPhone…

12 hours ago

Samsung enters the 1.4nm race, challenging TSMC and Intel: production to begin in 2029.

Fast Technology reported that Samsung was once considered to be lagging behind TSMC and Intel…

12 hours ago

The official announcement from Huawei states that the number of HarmonyOS 6 devices has surpassed 70 million.

Huawei has officially announced that the total number of terminal devices equipped with the HarmonyOS…

13 hours ago

REDMI’s most powerful flagship! The K100 series has been certified:

Fast Technology reported that REDMI's latest high-end flagship K100 series has officially obtained network access…

13 hours ago

The first batch of Huawei Mate XT2 phones to feature the Kirin 2026 chipset!

According to Fast Technology on July 2nd, in addition to the highly anticipated Mate 90…

13 hours ago

Xiaomi Mi 18 debuts with Leica dual 200MP cameras: Xiaomi’s most powerful standard flagship.

According to a recent leak from blogger Digital Chat Station on July 1st, the Xiaomi 18…

2 days ago