looking at the major giants in the current mobile phone market, without exception, they all have their own Soc chips. It is natural for the leading company Google to move towards manufacturing SoCs.
Starting from the Pixel 6 series, Pixel models are equipped with Google’s customized Tensor chip, which is a modified version of Samsung’s Exynos. Only the TPU, ISP and the matching Titan M2 security chip are Google’s own technologies.
But starting with Tensor G5, Google will achieve complete self-developed chips. According to reports, Tensor G5 will be manufactured by TSMC using a 3nm process and has now entered the tape-out stage.
The so-called tape-out is to manufacture chips through a series of process steps like an assembly line. This link is in the middle stage between chip design and chip mass production and is a key link in chip manufacturing.
If the tape-out is successful, the chips can be manufactured on a large scale based on it; otherwise, it is necessary to find out the reasons and carry out corresponding optimization design.
According to the plan, Google Tensor G5 will officially debut next year and will be first installed in the Pixel 10 series.
Analysts said that Tensor G5 is an important milestone for Google, representing a major breakthrough for Google Pixel in the field of mobile phone hardware. It will also challenge the iPhone, which will be a key step for Google to compete for the high-end market.
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