blogger Guan posted a photo of the Huawei Mate 70 series mobile phone cases.
As shown in the picture, the protective case proves that the Mate 70 series adopts a centered large circular lens design with a right-angle frame, and the power button of the protective case has an opening design, which means that the Mate 70 series will support side fingerprint recognition.
Combined with previous revelations, the Mate 70 series will support both 3D face recognition and side fingerprint recognition.
It is reported that the Huawei Mate 70 series uses a 3D ToF face recognition solution, which constructs three-dimensional depth information by measuring the time required for infrared light pulses to be emitted and returned.
Specifically, the 3D face recognition system emits infrared light pulses, which are reflected back after encountering the surface of an object. The sensor records the flight time of the light pulses, thereby calculating the distance to the object’s surface and generating a three-dimensional model. Compared with 3D structured light, 3D Tof technology has more advantages in response speed.
At the system level, Huawei Mate 70 series will be the first to launch the new pure-blooded Hongmeng. The system will no longer use the previous Linux architecture. Instead, it will be replaced by self-developed architectures such as the Hongmeng kernel, Ark compiler, ArkTS/Cangjie compilation language, etc. It supports Hongmeng kernel applications and is incompatible with Android APK.
It is worth noting that as of now, the supply chain of Huawei Mate 70 series has started supplying, and the internal plan is to officially release it in November.
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