MediaTek Dimensity 9600 undergoes major architectural overhaul: 2nm process drives aggressive performance.

According to the blogger “Digital Chat Station,” key information about MediaTek’s next-generation flagship chip has been revealed. Based on the symbols provided by the blogger, the chip is expected to be the Dimensity 9600 series, codenamed Canyon.

According to leaked information, this flagship chip is expected to be manufactured using TSMC’s advanced N2p process, and the CPU architecture will undergo a major overhaul, changing to a 2+3+3 all-large core solution, which is expected to be MediaTek’s first dual-ultra-large core mobile chip solution.

In addition to the significant upgrades to the core architecture and process technology, the Dimensity 9600 series will also adopt a tiered product strategy. Previously, this blogger revealed that the standard version of the series will use a specially selected, enhanced 3nm Dimensity 9500+, while the Pro and Pro Max versions will use the 2nm Dimensity 9600 series core chip, thus covering the needs of flagship models at different price points and creating a complete high-end product matrix.

On the technical front, MediaTek was deeply involved in the design of Google’s latest AI chip, TPU v7. This technological accumulation will directly empower the Dimensity 9600 series, helping it achieve a new breakthrough in energy efficiency.

Based on the industry’s usual pace, the Dimensity 9600 series is expected to officially debut in the second half of this year. At that time, OPPO and vivo’s next-generation flagship phones are expected to be the first to feature the full-fledged version of this chip. Xiaomi, Honor and other mainstream Android manufacturers’ annual flagship models will also most likely be launched with this chip this year.

However, with the recent price surge in the mobile phone market, the increased chip costs brought about by TSMC’s N2p process have also posed a significant challenge to major manufacturers in terms of terminal pricing. How to balance cost, selling price, and market acceptance will be a key consideration for this year’s models equipped with the Dimensity 9600 series.

Editor’s Review:

The Dimensity 9600 series’ dual-super-core and all-big-core architecture represents a significant breakthrough for MediaTek in the flagship chip market. TSMC’s N2p process and AI technology further enhance its competitiveness. The launch of this chip will further strengthen MediaTek’s influence in the high-end mobile chip market and bring a brand-new performance experience to the Android flagship market.