Categories: Xiaomi

Redmi K70 Pro Champion Edition Will Be Released By The End Of December

The upcoming release of the Redmi K70 Pro Champion Edition, a high-end flagship smartphone developed in collaboration between Redmi and Lamborghini is delayed due to production constraints. Wang Teng, a representative from Xiaomi, shared via Weibo that the K70 Pro Champion Edition features a different manufacturing process compared to the standard version, which has resulted in more complex production and initially low yield rates.

The phone is still in the phase of ramping up production capacity and is scheduled to be released at the end of December, with specific timing to be announced in mid to late December.

This model is Redmi’s most premium flagship for the year. It boasts impressive specifications, including 24GB of RAM and 1TB of storage. The K70 Pro 24GB+1TB version is priced at 4399 yuan, and the new process used for the Champion Edition is expected to push its price even higher, making it the most expensive flagship from Redmi this year. Additionally, it will be released in limited quantities.

The design of the Redmi K70 Pro Champion Edition is inspired by Lamborghini’s SQUADRA CORSE race cars, featuring a black upper half and a yellow lower half on the back of the phone, perfectly embodying a sense of speed and power.

The camera Deco has been redesigned, with the lens outer ring and Redmi logo accented in gold. The Lamborghini logo is also prominently displayed on the lower part of the phone, enhancing its recognition and overall texture.

The core specifications of the Champion Edition are consistent with the standard version. These include a 6.67-inch 2K display, Qing Shan eye protection, Snapdragon 8 Gen3 mobile platform, Light Hunter 800 sensor, Rage Engine 3.0 tuning, a large 5000mAh battery, and 120W wired flash charging.

The announcement of the Redmi K70 Pro Champion Edition highlights Redmi’s commitment to delivering high-end, limited-edition smartphones with unique designs and top-tier specifications.

via

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