MediaTek Dimensity 9400 and 8400 series have been launched one after another. Currently, the all-big-core strategy has outstanding results and the overall effect has been well received.
At present, MediaTek has gradually shifted its focus to the development of the next-generation Dimensity 9500 chip, which will be unveiled at the end of this year or early next year.
It should be noted that MediaTek originally planned to use TSMC’s 2nm process to manufacture the relevant chips, but considering the high price of the relevant process, and Apple will also introduce the relevant process in the M5 series chips to occupy production capacity.
Therefore, MediaTek chose the N3P process to manufacture Dimensity 9500, which is the third-generation 3nm process, for cost and production capacity considerations.
According to leaks, the Dimensity 9500 adopts a new 2+6 architecture design, including 2 X930 super cores and 6 A730 large cores. The frequency is expected to exceed 4GHz and support the SME instruction set.
It is known that the Dimensity 9400 adopts a 4+4 architecture solution, including 1 Cortex-X925 super core with a main frequency of 3.62GHz, 3 Cortex-X4 large cores with a main frequency of 3.3Ghz, and 4 Cortex-A720 large cores with a main frequency of 2.4Ghz.
In comparison, the biggest change of Dimensity 9500 is that the number of super-large cores has been changed to 2 and the number of large cores has been changed to 6. Blogger Digital Chat Station said that Qualcomm also designed a 2+6 solution. The X930 used in Dimensity 9500 is very powerful, and it is not a toothpaste-squeezing upgrade. The single-core performance of this specification has been greatly improved.
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