Categories: Processors

MediaTek Officially Unveils the Dimensity 8300: A Powerhouse for Flagships

MediaTek has officially announced the launch of the Dimensity 8300, a new chipset designed for premium smartphones. This latest addition to MediaTek’s lineup features a tri-cluster Arm V9 CPU, an Arm Mali-G615 MC6 GPU, a 780 APU, and LPDDR5X 8533 memory. The chipset is set to make its debut later this year in the Redmi K70 and will be a key component in other high-end phones to follow.

The Dimensity 8300, MediaTek’s newest upper-mid-range SoC, is tailored for high-end phones. Recent Geekbench listings have given a glimpse into the SoC’s capabilities, which have now been officially confirmed. MediaTek has also announced the Dimensity 8300 Ultra, which will be featured in a Redmi K70 series smartphone later this year.

At the core of the Dimensity 8300 is a tri-cluster CPU configuration, including one Cortex-A715 CPU running at 3.35 GHz. This is complemented by three Cortex-A715 cores at 3.2 GHz and four Cortex-A510 cores at 2.2 GHz. MediaTek claims that this setup is 20% faster than its predecessor, the Dimensity 8200, and 30% more power-efficient. This efficiency is partly attributed to the chip being manufactured on TSMC’s “second generation” 4 nm process node, likely N3E.

The Dimensity 8300 boasts an Arm Mali-G615 MC6 GPU, clocked at 1,400 MHz. This GPU offers a 60% performance improvement over its predecessor, along with a 55% increase in power efficiency. The high-speed LPDDR5X 8533 memory support, high clock speed, and MediaTek’s new “Star Speed Engine” make this GPU a formidable component in the chipset. Additionally, the chipset supports UFS 4.0 storage.

In line with the growing trend in AI, MediaTek has included a 780 APU in the Dimensity 8300, which is 3.3 times faster than its predecessor. This APU can natively run Large Language Models (LLMs) with up to 10 billion parameters, a significant achievement in on-device AI capabilities. The chipset’s 14-bit HDR-ISP Imagiq 980 ISP can capture 4K 60 FPS HDR videos and leverages the onboard NPU for tasks like noise reduction and bokeh effects.

The ISP of the Dimensity 8300 can support a 320 MP camera sensor or three 32 MP lenses simultaneously. Other notable features of the Dimensity 8300 include support for SA and NSA networks (excluding mmWave radio), Wi-Fi 6E, Bluetooth 5.4, GPS, GLONASS, NavIC, BeiDou, and QZSS. It can also power displays up to 180 Hz FHD+ or 120 Hz QHD+. MediaTek has hinted at compatibility with “dual displays,” which could be related to foldable devices, though details remain unclear.

via

Recent Posts

Honor’s strongest flagship! Honor Magic 7 series pre-launched: AI-focused

 Honor announced that the Honor Magic7 series will be the first to be equipped with…

11 hours ago

iPhone 16 series highlights preview: imaging and AI features are most worth looking forward to

At 1:00 a.m. Beijing time on September 10, Apple will hold a special event with…

11 hours ago

Lenovo moto S50 hands-on: the most hardcore small-screen phone in its class

If there is any new trend worth noting in today's mobile phone market, the resurgence…

11 hours ago

Huawei Mate XT Extraordinary Master Tri-Fold Phone Officially Available for Pre-order

On September 7, Huawei's first three-fold screen mobile phone, Huawei Mate XT Extraordinary Master, officially…

11 hours ago

OnePlus 13 will be unveiled in October: the world’s first second-generation Oriental screen

 OnePlus 13 will be officially unveiled in October. According to official information, OnePlus 13 is the…

11 hours ago

Meizu Lucky 08 mobile phone officially announced: the first to launch Flyme AIOS

 the official Weibo account of "Xingji Meizu Technology" announced a new phone today - Meizu…

1 day ago