Samsung

The world’s first 2nm chip! Samsung has begun producing Exynos 2600 chip prototypes

Samsung has started preparations for mass production of the Exynos 2600 chip.

The report pointed out that Samsung’s wafer foundry has begun mass production of the Exynos 2600 prototype chip. This processor using a 2nm process node will become a milestone for Exynos chips. In the earlier testing phase, the chip yield rate reached 30%. Currently, both the wafer input and yield have increased.

It is reported that Samsung’s wafer foundry department and system LSI chip design department have started joint research since last month, with the goal of increasing the yield rate of Exynos 2600 to more than 50% while maintaining unchanged performance.

The South Korean tech giant has set an internal goal to start risk trial production of the Exynos 2600 chip before the end of this year. During this phase, chip quality verification and functional testing will be completed, and mass production will only officially begin after analyzing process safety and yield standards.

If Exynos 2600 passes verification smoothly and the yield rate reaches expectations, mass production will start at the end of this year. The Galaxy S26 series, which will be launched in February next year, will be the world’s first Exynos 2600, becoming the industry’s first high-end flagship equipped with a 2nm chip, ahead of Qualcomm, MediaTek and Apple. The latter three giants will commercialize 2nm chips as early as the second half of next year.

It is worth noting that the entire semiconductor industry is closely watching the performance of Exynos 2600. This will be the first chip to adopt Samsung’s 2nm process. Its success or failure will directly affect Samsung’s position in the advanced process field.

Currently, almost all brands use TSMC’s 3nm process to produce chips. If Samsung wants to share this market, it must ensure that Exynos 2600 has no loopholes in performance, energy efficiency and heat control. Once successful, Samsung’s three major departments of wafer foundry, mobile communications (MX) and system LSI will achieve a win-win situation.

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