Apple’s first 2nm chip: The A20 series is the first to use WMCM packaging technology.

According to media reports, Apple’s A20 series chips next year will use TSMC’s 2nm process, making it Apple’s first 2nm chip.

Compared to the A19 series, one of the biggest changes in the A20 and A20 Pro is the shift from the previous InFO packaging technology to WMCM, the core change of which is packaging first and then cutting.

Specifically, WMCM packaging technology interconnects and integrates multiple modules such as CPU, GPU and neural network engine on a complete wafer, and finally cuts them into individual chip modules. This method eliminates the necessary intermediary layer in traditional packaging, resulting in faster signal transmission.

In addition, the cache of Apple’s A20 series is expected to be further improved. It is estimated that the A20 performance core L2 cache will be 8MB, the energy efficiency core L2 cache will be 4MB, and the SLC cache will be 12MB; the A20 Pro performance core L2 cache will be 16MB, the energy efficiency core L2 cache will be 8MB, and the SLC cache will be 36MB-48MB.

As is customary, the A20 Pro chip debuted in the iPhone 18 Pro, iPhone 18 Pro Max, and foldable iPhones, while the A20 chip was introduced in the iPhone 18.

Apple has adjusted its release schedule this time. Next fall, Apple will launch the iPhone 18 Pro series and foldable iPhone, while the standard iPhone 18 will be unveiled in the first half of 2027.