Huawei has reached a new milestone: Kirin-powered devices have shipped more than 100 million units since 2023.

Fast Technology reported that Huawei held a Kirin chip technology communication meeting. Huawei revealed that since 2023, the cumulative shipments of terminals equipped with Kirin chips have exceeded 100 million units.

As is well known, the Mate 60 series was released in 2023, featuring the Kirin 9000S chip, marking the return of the Kirin chip. In September 2025, at the Mate XTs Extraordinary Master launch event, Yu Chengdong, Huawei’s Executive Director and Chairman of the Terminal BG, announced that the phone would be equipped with the Kirin 9020 chip.

This is not only the first public appearance of the Kirin 9020, but also the first time the Kirin chip has appeared at a Huawei press conference in four years since 2021, marking Huawei’s achievement of full-chain self-reliance and control in chip design and manufacturing.

After a year’s hiatus, the Kirin 9050 Pro has officially debuted, first appearing in the Mate XT 2 Master. Unlike other SoCs, the Kirin 9050 Pro is the first to feature logic folding technology, achieving “time miniaturization” through logic folding. Its core idea is no longer simply to shrink the size of the transistor plane, but to shift towards “time miniaturization,” shortening the signal transmission latency within the chip.

In traditional chips, all logic circuits are laid flat on a single-crystal silicon plane, and long metal traces are used to transmit signals between computing units and caches. A large amount of power is consumed in signal transmission rather than computing itself.

Logic folding uses wafer-to-wafer hybrid bonding technology to split the originally two-dimensional circuitry and distribute it to the upper and lower silicon wafers. It is then connected by a massive amount of high-density vertical interconnects, replacing long planar traces.

It’s important to note that logic folding isn’t simply stacking two chips together; it requires redesigning the internal circuitry and addressing issues like heat dissipation and yield. It doesn’t conflict with advanced manufacturing processes, and the two approaches can be combined in the future. Huawei believes this technology still has the potential for continuous evolution over the next decade.

Besides pioneering the logic folding technology, another major breakthrough for Huawei lies in its seamless integration of chip, hardware, operating system, and cloud capabilities. Starting from user needs, it uses a software-hardware synergy approach to enhance the overall user experience. This system-level integration capability, from the underlying layer to the cloud, is precisely the key to Huawei’s continued breakthroughs.