iPhone 18 series debuts! Apple A20 processor uses a new packaging process

Analyst Ming-Chi Kuo wrote that next year’s iPhone 18 series will be equipped with A20. This processor abandons the InFO packaging solution and instead adopts WMCM (wafer-level multi-chip module) packaging technology.

It is reported that WMCM, the full name of which is Wafer-Level Multi-Chip Module, is an advanced semiconductor packaging method that allows different components such as SoC and DRAM to be integrated at the wafer stage. This technology does not require the use of an interposer or substrate to connect the chips, which helps improve heat dissipation while reducing material usage and production steps, thereby improving yield and production efficiency.

Guo Mingchi said that Changxing Materials defeated Japanese companies Namics and Nagase to become TSMC’s supplier of advanced packaging materials for the first time. It is expected to go into mass production in 2026, pass TSMC’s verification and win TSMC’s advanced packaging material order for the first time. This is of great significance to Changxing.

According to the plan, Apple will launch the iPhone 18 series in the second half of next year. It is reported that Apple will launch the iPhone 18 Pro, iPhone 18 Pro Max and iPhone 18 Air at the same time, while the standard version of iPhone 18 will be postponed.