Mobiles

Red Magic 12 Pro+ Design Details Revealed: The Industry’s Only RGB Water-Cooled Phone

Fast Technology reported that the Red Magic 12 Pro+’s design was officially revealed today. The official website further disclosed design details of the new phone, including its transparent body, heat dissipation structure, and grip feel.

According to reports, the Red Magic 12 Pro+ continues the brand’s iconic transparent design with a more minimalist overall style, while introducing a new dual-ring water cooling design to further expand the visible area of ​​the water cooling system.

The new machine adopts the industry’s first water-cooled RGB visual design, which shows the internal water-cooling pipeline through the transparent back shell. Combined with RGB lighting effects, the heat dissipation system becomes an integral part of the body design, giving it a high-tech feel.

In terms of design, the Red Magic 12 Pro+ features a 2.5D micro-arc frame with more rounded edges, while further optimizing the thickness and weight of the body, claiming to be “the Red Magic flagship with the best feel to date”.

The Red Magic 12 Pro+ continues the true full-screen design without any holes, and is equipped with the ninth-generation under-display full-screen technology. The black border of the screen has been narrowed from 1.25mm in the previous generation to 0.96mm, bringing a more complete front visual effect.

In addition, the new phone continues to use Red Magic’s signature flat back cover design, with the rear camera not protruding at all, making it less uncomfortable to hold horizontally while playing games.

In terms of performance, the Red Magic 12 Pro+ will be equipped with Qualcomm’s sixth-generation Snapdragon 8 Super Edition, which is built using TSMC’s 2nm GAA process and has a CPU super core frequency of over 5GHz.

In terms of GPU, the chip is equipped with Adreno 850 and introduces Matrix Cores and Neural Fusion technology, while also featuring an X105 baseband and Offset PoP high thermal conductivity packaging.

The Red Magic 12 Pro+ will adopt a dual cooling solution of liquid cooling and air cooling, and will debut several new heat dissipation technologies. Combined with Offset PoP high thermal conductivity packaging, it will further improve the sustained performance under long-term high-load gaming scenarios.

It is understood that the Red Magic 12 Pro+ will be officially released on October 15th at 14:30.

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