The specifications of a new mid-sized phone from a certain factory equipped with the Dimensity 9500 chip have been leaked. Combined with previous information, it is speculated that the phone is most likely the vivo X300 standard version, positioned as a small-screen imaging flagship.
The imaging configuration is its biggest highlight. The main camera adopts a 200-megapixel 1/1.4-inch large-bottom high-pixel solution, supports ISZ 35mm/50mm crop zoom, and the imaging quality is reported to be “very high” .
In terms of telephoto, it is equipped with a 1/2-inch new 3X optical focus prism periscope and uses a traditional single-refraction periscope. It is not a ship-style design, but it does support telephoto macro and 3x optical zoom capability .
In terms of hardware, the vivo X300 will be equipped with the MediaTek Dimensity 9500 chip, which is built based on TSMC’s third-generation 3nm process. It inherits the full-core architecture and consists of 1*Travis+3*Alto+4*Gelas. The main frequency exceeds 4GHz, and the performance has further soared.
In addition, the phone uses a 6.3-inch small screen design, which is different from the 6.67-inch screen of the previous generation X200.
At the same time, 3D ultrasonic technology, wireless charging and full-level waterproof capabilities are further decentralized to become standard, and the overall configuration is balanced.
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