Honor enters the foldable phone market: debuts with Qualcomm Snapdragon 8E6 Pro.

Blogger Digital Chat Station hinted that Honor is accelerating the development of its first wide foldable flagship, which will be equipped with the Qualcomm Snapdragon 8E6 Pro chip. This will also be the first wide foldable screen model in the Android camp to use a 2nm process chip. The new product is expected to be officially released in the first half of next year.

According to leaks, the Honor wide foldable screen features a 7.6-inch inner screen and a 5.5-inch outer screen. The camera DECO adopts a strip-shaped track design, with a 200-megapixel large sensor main camera and a periscope telephoto lens. The battery capacity exceeds 7000mAh, making it the wide foldable flagship with the largest battery in its price range.

Compared to traditional foldable screens, wide foldable screens are wider and closer to the folding form of a tablet or book. Traditional foldable screens, in pursuit of a square unfolded ratio, often result in a body that is too narrow when folded and nearly square when unfolded, leading to noticeable black bars at the top and bottom when watching videos.

The foldable screen adopts a widescreen ratio close to that of a tablet computer. When unfolded, it provides a near-PC-like field of view and operating efficiency for both landscape viewing and split-screen multitasking, making full use of every inch of the screen.

Besides Huawei, which has already released a wide foldable phone, Honor, Apple, Samsung, Xiaomi, OPPO, and other manufacturers all have plans to launch wide foldable phones. Judging from current trends, wide foldable technology is expected to become a core upgrade direction for the foldable screen industry in the future.