Oppo

OPPO Find X9 engineering machine exposed: King of Dimensity 9500

Blogger Digital Chat Station revealed that the OPPO Find X9 engineering machine is equipped with the Dimensity 9500 platform, adopts a 1.5K large R-angle straight screen, and uses LIPO ultra-narrow four-sided packaging technology. The lens Deco is not a big circle , and one of the undetermined versions is the matrix design in the upper left corner.

Compared with the previous generation Find X8 series, the OPPO Find X9 series has three major changes. First, it returns to straight screens and no longer launches equal-depth micro-curved screens. Second, the processor has been upgraded to Dimensity 9500, which is MediaTek’s most powerful mobile phone chip. Third, the lens Deco is no longer a large circle in the center, and the industrial design will usher in major changes.

According to leaks, the Dimensity 9500 will be released in September this year, which means that the OPPO Find X9 series will be released in September at the earliest.

In terms of specifications, the Dimensity 9500 is built based on TSMC’s N3P process (TSMC’s third-generation 3nm process), and the CPU is upgraded to a new generation of full-large core architecture, including 1*Travis+3*Alto+4*Gelas, and it is still an 8-core design.

At the same time, Dimensity 9500 integrates the Immortalis-Drage GPU and adopts a new micro-architecture to improve ray tracing performance while reducing power consumption. The computing power is expected to reach 100TPOS.

In addition, the screen sizes of the OPPO Find X9 series are 6.59 inches and 6.78 inches, corresponding to the standard version and Pro version respectively. Both models will be unveiled on the same stage.

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