REDMI K90 Max will be released this month, and the official website today revealed the appearance of the new phone for the first time.
The K90 Max retains the flat screen and straight edge design, and the official Space Silver color scheme features a cool silver body and aluminum alloy frame, presenting a minimalist style.
The overall design is the same as the K90 Pro Max, using a large horizontal module, but the right side has been changed from a speaker to a fan grille.
Below the module are ultra-wide, densely packed air vents. The large air inlet and outlet, combined with an 18.1mm ultra-large fan, is expected to provide more powerful heat dissipation than similar models in the past.
According to official information, the K90 Max is about 6% better than mainstream solutions, with a single-minute airflow of 0.42 CFM, which is 1.3 times that of competitors. This allows the REDMI K90 Max to cool down the temperature by 10°C in 100 seconds.
In terms of structural design, the machine adopts a suspended air-cooling architecture, which is completely independent and does not damage the motherboard. The advantage is that it does not affect the dustproof and waterproof performance of the whole machine, supporting IP66/IP68/IP69, and will not affect the battery capacity.
For key components, the REDMI K90 Max uses metal bearings, which are rare in the industry. Compared with the common plastic bearing solution, it has certain advantages in terms of durability and stability.
The REDMI K90 Max offers three fan speed modes, which can be flexibly switched according to different usage scenarios. In high-speed, powerful cooling mode, the fan noise is controlled at 32dB, improving heat dissipation efficiency while ensuring a quiet experience for daily use.
REDMI Product Manager Hu Xinxin stated that some competitors advertise their decibel levels as low and by picking up sound from the front of the phone, while REDMI uses the highest setting, directly picking up sound from the fan. Any comparison will show that REDMI is superior.
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