Honor Magic8 RSR is poised for launch: the only dual 3D flagship phone.

Honor Magic8 RSR has received 3C certification and is expected to be launched before the Spring Festival. This will be Honor’s most powerful imaging flagship.

Compared to its competitors, the Honor Magic8 RSR is the only top-tier model that supports dual 3D technology, including 3D face recognition and 3D ultrasonic in-screen fingerprint scanning.

Currently, 3D ultrasonic screen fingerprint technology has been widely adopted in flagship models of major brands, and the Honor Magic8 RSR will support both 3D ultrasonic and 3D face recognition.

Honor engineer Cao Hepu said that 3D face recognition is not just about piling up components. It requires customized collaborative modifications and upgrades to the chip platform, system, and algorithm. At the same time, it requires massive amounts of data for training to achieve recognition and anti-counterfeiting capabilities that are compatible with all races and all-weather lighting environments. All of this requires long-term technological accumulation and huge resource investment.

In addition, the main camera of the Honor Magic8 RSR has been upgraded to the new OV50R, which has 50 million pixels, a 1/1.3-inch super large sensor, and is equipped with the new generation of LOFIC technology.

The principle behind LOFIC technology is to place a high-density capacitor in each photodiode of the phone’s image sensor to collect photoelectrons that might otherwise overflow due to saturation. When the number of photoelectrons converted by a photodiode exceeds its maximum capacity, the excess photoelectrons flow into adjacent capacitors, thus preventing overexposure when shooting bright scenes.

In addition, the Honor Magic8 RSR will be equipped with the fifth-generation Qualcomm Snapdragon 8 Ultra platform, a battery capacity of over 7000mAh, and support satellite communication.