Huawei’s dual flagship lineup arrives in September! The Mate XT2 tri-fold folding phone leads the charge

According to Fast Technology on July 28, major mobile phone manufacturers such as Huawei and Apple will release their annual flagship products in September this year, which is expected to become one of the most competitive flagship mobile phone release months in recent years.

Today, digital blogger “Digital Chat Station” posted an article revealing that the same mobile phone brand will hold two press conferences in September. In the first ten days of the month, they will release a three-fold screen phone, and in the second ten days, they will launch their highly anticipated annual flagship.

Based on current industry product planning, the brand the blogger is referring to is likely Huawei: the tri-fold screen product to be unveiled in early September is expected to be the Huawei Mate XT2, and the annual flagship to be launched in late September is the Mate 90 series.

As Huawei’s new generation of tri-fold screen flagship, the Mate XT2 is expected to continue exploring the upper limit of foldable screen phone form factors.

According to previous leaks, the new phone is expected to change the S-shaped “folding” design used in the previous generation and instead adopt a brand-new U-shaped triple-folding structure, further improving the reliability, durability, and overall experience of the phone when folded.

In terms of core configuration, the Huawei Mate XT2 is expected to be the first to be equipped with the Kirin 9050 series flagship chip and will come pre-installed with the HarmonyOS 7 operating system.

The Mate 90 series is expected to include multiple models such as the Mate 90, Mate 90 Pro, Mate 90 Pro Max, and Mate 90 RS, covering different positioning and price points.

This series also features the Kirin 9050 series chip. According to reports, the new chip will be built based on the Kirin 9050 series chipset, and its performance will be significantly improved compared to the previous generation.

This is the world’s first mass-produced mobile phone chip equipped with logic folding technology. It upgrades the core logic circuit to a dual-layer vertical stacking architecture, replacing the traditional “geometric miniaturization” with “time miniaturization”. Without relying on more advanced photolithography processes, it achieves a leapfrog improvement in performance and energy efficiency.