iPhone 18 Pro first release! Apple A20 chip revealed to use TSMC’s 2nm process

Apple industry chain analyst Jeff Pu said in a report that the iPhone 18 Pro series and folding screen models (tentatively called iPhone 18 Fold) will be equipped with a significantly upgraded A20 chip. This processor will not only achieve new breakthroughs in process technology, but will also bring key architectural innovations.

Specifically, Apple’s A20 chip will be the first to use TSMC’s 2nm process, which will achieve a generational leap compared to the second-generation 3nm (N3E) used in the iPhone 16 Pro and the third-generation 3nm (N3P) used in the iPhone 17 Pro. In addition, the transistor density of the 2nm process has been further improved. It is expected that the performance will be improved by 15% compared to the A19, and the energy efficiency will be improved by 30%.

Jeff Pu also pointed out that in addition to the 2nm process, the A20 chip will also use TSMC’s new generation of wafer-level multi-chip packaging technology (WMCM), which will achieve three major innovations:

First, the memory architecture will be innovated: RAM will be directly integrated with the CPU/GPU/neural network engine on the same wafer, replacing the existing separate design; second, the performance will be improved, and the heat dissipation efficiency will be increased by 20%, and the battery life will be extended by 10-15%; third, the chip packaging area will be reduced by 15%, freeing up more space for other components inside the iPhone.

Based on information from all sources, the iPhone 18 Pro series and foldable screen models to be released in September 2026 will not only have a significant performance upgrade thanks to the A20 chip, but will also have significant improvements in heat dissipation, AI and other aspects, which is worth looking forward to.