Fast Technology reported that topics related to the iPhone 18 Pro trended on Weibo this afternoon, attracting widespread attention.
According to the blogger Digital Chat Station, the iPhone 18 Pro series will bring some different changes. Apple is testing a special HIAA punch-hole solution with a smaller island area, which will be the smallest punch-hole area in Apple’s history for an iPhone.
According to previous leaks, Apple is testing a superlens solution to reduce the size of the “smart island.” A superlens is a two-dimensional planar lens structure that, compared to traditional lenses, offers advantages such as thinner size, lighter weight, better image quality, and easier integration, providing a potential solution for compact optical systems.
With this technology, the size of Apple’s Face ID components will be reduced, thereby decreasing the area of the punch-hole and resulting in a higher screen-to-body ratio and a better visual experience.
In addition, the iPhone 18 Pro will be equipped with Apple’s self-developed C2 modem, replacing the Qualcomm solution. The C2 will bring faster speeds, higher energy efficiency, and will also support 5G millimeter wave, making up for the shortcomings of the previous generation C1. This move allows Apple to reduce its dependence on Qualcomm.
It’s worth noting that Apple also plans to change the iPhone release schedule. Specifically, the iPhone 18 Pro, iPhone 18 Pro Max, and foldable iPhone will be released in September 2026, while the iPhone 18 and iPhone 18e will not be available until spring 2027.
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