Fast Technology reported that the blogger Digital Chat Station released detailed specifications of the MediaTek Dimensity 8500, a mid-range performance chip.
Built using TSMC’s 4nm process, it features an 8-core A725 architecture with a super-large core frequency of 3.4GHz in current prototype testing. It integrates a Mali-G720 GPU with a frequency of 1.5GHz±, achieving an AnTuTu score of 2.2 million±. The GPU’s theoretical performance surpasses that of the Snapdragon 8 Gen3/8s Gen4.
In addition, the Dimensity 8500’s ISP and peripherals have also been upgraded, which can improve other aspects of the user experience of the corresponding terminal.
According to leaks, REDMI Turbo 5 will be the world’s first to feature the Dimensity 8500 processor, with its release date moved up to the end of the year.
In addition to performance upgrades, the Turbo 5 will also feature a metal frame and large rounded corners, significantly improving its premium feel and bringing it in line with the Pro version.
The screen remains a 6.6-inch 1.5K display, and the overall design is minimalist, with a dual-camera setup expected to be retained.
The device will also be equipped with a large-capacity battery of over 7000mAh, which will significantly improve its battery life.
The REDMI Turbo 4 was released in January this year. It features a 6.67-inch 1.5K flat screen, a 20-megapixel front camera, and a 50-megapixel main camera + 8-megapixel ultra-wide-angle rear camera.
It is powered by MediaTek Dimensity 8400-Ultra and has a built-in 6550mAh Xiaomi Jinshajiang battery, supporting 90W fast charging, which can charge to 100% in 45 minutes.
In addition, Turbo 4 supports IP66, IP68, and IP69 dust and water resistance, tri-frequency BeiDou + dual-frequency GPS, and is equipped with the Surge OS 2 system.
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