The well-known digital blogger @数码闲聊站 revealed a model equipped with the Dimensity 8500 chip. Judging from the peripheral design and configuration, it is very likely to be the Turbo5, the iterative model of REDMI’s performance phone Turbo4.
According to leaked information, the new phone is expected to be the first to be equipped with MediaTek’s new generation Dimensity 8500. It is expected that the overall performance will surpass the current Snapdragon 8s Gen4, becoming a strong competitor for the new generation of mid-range chips .
In addition, the phone will be equipped with a large-capacity battery of over 7000mAh, and its battery life will be significantly improved, comparable to that of Turbo4 Pro.
In comparison, REDMI Turbo 4 is equipped with MediaTek Dimensity 8400 mobile platform and a built-in 6550mAh large-capacity battery.
In terms of peripheral design, REDMI Turbo 5 will continue the iconic large R-angle screen design of the Turbo4 series, with a metal middle frame and a minimalist Deco design. The overall appearance retains the classic elements of the series and shows a unique sense of refinement in details.
Kazam is Focused on creating and reporting timely content in technology with a special focus on mobile phone technology. Kazam reports, analyzes, and reviews recent trends, news and rumors in mobile phone technology and provides the best possible insights to enhance your experience and knowledge.
Doubao Mobile Assistant's "Screen Automation Execution Protocol" (SAEP) officially ended its 30-day public comment period.…
Fast Technology reported that Visionox officially confirmed that the Honor WIN2 series is the world's…
According to data released by the blogger Digital Chat Station on October 17th, as of…
According to Fast Technology on October 17, recent rumors have suggested that Huawei's new sub-brand…
Apple's first foldable screen iPhone Duo officially went on pre-sale last night at 8 pm.…
According to Fast Technology on October 15th, the Honor WIN2 will be released on October…