Apple is developing a second-generation iPhone Air, which will focus on addressing shortcomings in areas such as imaging, battery life, and heat dissipation. It is expected to be released in the spring of 2027.
Previously, it was reported that due to lower-than-expected sales of the first-generation iPhone Air, Apple had temporarily removed the second-generation product from its release schedule and had not given a new launch date.
However, subsequent reports indicate that Apple did not cancel the iPhone Air 2 project, and related research and development work is still ongoing.
In terms of imaging, the original iPhone Air was limited by its ultra-thin body and only had one rear camera. The iPhone Air 2 is expected to be upgraded to a dual-camera setup, with the new lens expected to be an ultra-wide-angle lens rather than a telephoto lens. The overall configuration will be similar to the base model iPhone.
In terms of performance, the iPhone Air 2 is expected to be equipped with the A20 Pro chip, which is a further upgrade compared to the A19 Pro used in the original model.
It is reported that the A20 Pro will be Apple’s first iPhone chip built using a 2nm process and will introduce wafer-level multi-chip module technology, integrating SoC and DRAM at the wafer level to further improve performance and energy efficiency.
Battery life is also a key focus of this upgrade. Supply chain sources say that the iPhone Air 2 will be equipped with a 3500mAh battery, an increase of more than 10% compared to the original model’s 3149mAh.
With the energy efficiency optimization brought by the A20 Pro chip, the actual battery life of the new phone is expected to be significantly improved.
In terms of heat dissipation, the iPhone Air 2 may introduce VC vapor chamber cooling technology, which was previously used in the iPhone 17 Pro and can improve heat dissipation and sustained performance under high load scenarios.
Overall, the iPhone Air 2 will continue its slim and lightweight positioning, but Apple is trying to make up for the shortcomings of the ultra-thin body by upgrading features such as dual cameras, a larger battery, a 2nm chip, and a VC heat sink.
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