iPhone 18 Pro debuts! Apple A20 Pro features two major upgrades: first 2nm process and WMCM packaging.

Apple will hold an autumn product launch event this September, where, in addition to the iPhone 18 Pro series, the first foldable screen phone, the iPhone Ultra, is also expected to be unveiled.

Based on current leaks, the iPhone 18 Pro series and iPhone Ultra will be the first to feature Apple’s A20 Pro chip.

Today, 9to5Mac summarized two core upgrades of the A20 Pro, including the first use of a 2nm process technology and the introduction of a brand-new wafer-level multi-chip module packaging technology.

In terms of manufacturing process, the A20 Pro is expected to be manufactured using TSMC’s new 2nm process, becoming Apple’s first iPhone chip to use the 2nm process.

Compared to the currently used 3nm process, the 2nm process can integrate more transistors in a similar chip area, thereby further improving performance and energy efficiency, and providing more room for upgrades of modules such as CPU, GPU and neural engine.

It is unclear at present which aspects Apple will focus on to improve the performance of the A20 Pro, but thanks to the process upgrade, the new chip is expected to see significant improvements in performance release and power consumption control.

In addition to the 2nm process, the A20 Pro will also be the first to adopt WMCM (Wafer-Level Multi-Chip Module) packaging.

Compared to traditional packaging methods, WMCM can directly integrate components such as SoC and DRAM on the wafer level before the wafer is diced into individual chips, reducing reliance on traditional interposers and packaging substrates.

This solution can shorten the physical distance and signal transmission path between the processor and memory, improving communication efficiency while also helping to improve signal integrity, heat dissipation, and data transmission power consumption.

For iPhones, WMCM packaging is expected to further improve the data exchange efficiency between the chip and memory, bringing more significant performance and energy efficiency improvements in scenarios such as edge AI, high-load gaming, and multitasking.