OPPO Find X9 Pro first exposure: quad-camera dual periscope adjusted to triple-camera single periscope

Blogger Digital Chat Station revealed that the early engineering machine of OPPO Find X9 Pro is equipped with MediaTek Dimensity 9500 platform and a rear three-camera solution, including a main camera, an ultra-wide-angle camera, and a 200-megapixel periscope telephoto camera.

Compared with Find X8 Pro, the biggest change in OPPO Find X9 Pro is in the imaging part. The former is a four-camera dual periscope telephoto, including a 50-megapixel 3X periscope and a 50-megapixel 6X periscope telephoto, while the next-generation flagship Find X9 Pro is adjusted to a 200-megapixel single periscope. This 200-megapixel telephoto has a super large bottom of 1/1.4 inches and is the largest periscope in OPPO’s history.

In addition, OPPO Find X9 Pro is the first to be equipped with MediaTek Dimensity 9500 platform. This chip will be built based on TSMC’s N3P process and adopt a new full-large core architecture. The CPU includes 1*Travis+3*Alto+4*Gelas, of which Travis and Alto are Arm’s latest Cortex-X9 series super-large cores, and Gelas is Arm Cortex-A7 series large core.

In addition, the Dimensity 9500 will integrate the Immortalis-Drage GPU with a new micro-architecture to improve ray tracing performance and reduce power consumption. It has 16MB of L3 cache and 10MB of SLC cache. This is MediaTek’s most powerful mobile phone chip.