The most powerful Dimensity 9500 flagship! OPPO Find X9 Pro parameters exposed
Blogger Digital Chat Station hinted that the OPPO Find X9 Pro has a rear 50-megapixel main camera, a 50-megapixel ultra-wide-angle camera, and a 200-megapixel periscope telephoto camera.
Among them, the 200-megapixel periscope telephoto model is the Samsung HP5. This sensor uses a 28nm process, has a single pixel size of 0.5μm, has a large 1/1.56-inch base, and supports DCG-HDR.
Compared with Find X8 Pro, the biggest change in OPPO Find X9 Pro is in the imaging part. The former is a four-camera dual periscope telephoto, including a 50-megapixel 3X periscope and a 50-megapixel 6X periscope telephoto, while Find X9 Pro is adjusted to a 200-megapixel single periscope, which is also OPPO’s first 200-megapixel periscope phone.
In addition, OPPO Find X9 Pro is the first to be equipped with MediaTek Dimensity 9500 platform. This chip will be built based on TSMC’s N3P process and adopt a new full-large core architecture. The CPU includes 1*Travis+3*Alto+4*Gelas, of which Travis and Alto are Arm’s latest Cortex-X9 series super-large cores, and Gelas is Arm Cortex-A7 series large core.
To sum up, Find X9 Pro will be the most powerful Dimensity 9500 flagship in the industry, and the new product is expected to be unveiled in September or October.
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