The first Xuanjie O1 chip! Xiaomi 15S Pro will be released tonight
Xiaomi’s 15th anniversary strategic new product launch conference will start at 7 o’clock tonight, and will be hosted by Lei Jun himself.
One of the most important new products this time is Xiaomi 15S Pro, which is the first to be equipped with Xiaomi’s self-developed 3nm chip Xuanjie O1.
This is Xiaomi’s self-developed mobile phone main chip, which adopts TSMC’s second-generation 3nm process, integrates 19 billion transistors, and has a 10-core CPU architecture design. Its performance is close to that of Snapdragon 8 Extreme Edition and Dimensity 9400.
In order to develop the Xuanjie O1, Xiaomi has invested heavily. As of the end of April 2025, the cumulative R&D investment in the Xuanjie project has exceeded 13.5 billion yuan, and the R&D team has more than 2,500 people. It is expected that the R&D investment will exceed 6 billion yuan in 2025.
The appearance of Xiaomi 15S Pro continues the design language of Xiaomi 15 Pro and uses a black aramid fiber back cover.
A new “XRING” logo has been added to the flash area of the phone. It is reported that this logo is related to the Xuanjie O1 chip and may also appear on products such as the Xiaomi Tablet 7 Ultra, becoming a new logo for Xiaomi’s high-end product line.
In addition, the logo of Xiaomi 15S Pro has changed from black to gold, and the power button also uses a small gold bar design.
The front is a 6.73-inch equal-depth four-curved screen with a resolution of 3200*1440 and supports 1-120Hz LTPO variable refresh rate.
It has a built-in 6100mAh large battery to ensure battery life and supports 90W fast charging.
In terms of imaging, the Xiaomi 15S Pro will have a rear Leica triple-camera system, which is expected to continue to use the combination of the Light Hunter 900 main camera + periscope telephoto.
It is worth noting that the digital blogger “Digital Chat Station” said that Xiaomi 15S Pro cannot be simply defined as a chip-changing phone. The phone has been upgraded from the inside out . In addition to performance changes, the screen, imaging, AI, etc. will all call on their own things, and some hardware will also be upgraded.
The blogger also said that since this machine is destined not to recover its R&D costs anyway, it is better to pile up materials from the inside out.
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