Dimensity 9500 imaging flagship! OPPO Find X9 Pro parameters exposed
The well-known digital blogger @数码闲聊站 revealed that
OPPO’s big cup model X9 Pro this year will be equipped with MediaTek’s most powerful processor Dimensity 9500, and will be the first to be equipped with a 200-megapixel periscope telephoto lens .
According to leaked information, the MediaTek Dimensity 9500 chip is manufactured based on TSMC’s third-generation 3nm process N3P, adopts a full-large core architecture, and consists of 1*Travis+3*Alto+4*Gelas, with a main frequency exceeding 4GHz. Among them, Travis and Alto are Arm’s new generation X9 series super-large cores, supporting the SME instruction set, and Gelas is Arm’s new generation A7 series large core.
In terms of imaging, OPPO Find X9 Pro is the first mobile phone in the series equipped with a 200-megapixel periscope telephoto camera. The expected model is Samsung HP5. This sensor uses a 28nm process, with a single pixel size of 0.5μm, a large 1/1.56-inch bottom, and supports DCG-HDR .
Compared with its predecessor X8 Pro, the camera configuration of X9 Pro has been adjusted from 4 lenses to 3 lenses. In addition to the 200-megapixel periscope, it is also equipped with a 50-megapixel main camera and a 50-megapixel ultra-wide-angle lens.
The previous generation’s quad-camera dual periscope telephoto configuration includes a 50-megapixel 3X periscope and a 50-megapixel 6X periscope telephoto. In order to accommodate the 200-megapixel ultra-large bottom periscope module, the X9 Pro made this adjustment. We might as well regard this change as a technical trade-off and optimization.
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