The Exynos 2700 processor has entered mass production: debuting in the Galaxy S27 series.

According to blogger iIce Universe, Samsung Electronics has begun mass production of the Exynos 2700 processor, with production volume 10% higher than the previous generation.

This processor will debut in the Galaxy S27 series, using Samsung’s second-generation 2nm process node SF2P, which offers a 12% performance improvement and a 25% reduction in power consumption compared to the previous generation.

In terms of packaging, it is the first to use FOWLP-SbS (fan-out wafer-level side-by-side packaging) technology, which covers the application processor and memory with a copper-based “heat path block” to achieve integrated heat conduction between the AP and DRAM, which is more efficient than the direct contact heat sink solution of Exynos 2600.

In terms of CPU, the chip adopts a “4+1+4+1” ten-core dual Prime cluster design. The first group includes one Arm C1-Ultra core (3.36GHz) and four C1-Pro cores (2.88GHz), while the second group consists of one C2-Ultra core (4.24GHz) and four C2-Pro cores (3.74GHz). The C1 core is responsible for continuous performance and energy efficiency.

The GPU integrates the Xclipse 970 based on the AMD RDNA 5 architecture, which has 16 compute units and is expected to improve performance by 30% to 40%.

In terms of storage, it supports LPDDR6 memory and UFS 5.0 flash memory, which greatly improves transmission efficiency.

Previously leaked Geekbench 6.7.1 engineering sample scores showed a single-core score of 4328 and a multi-core score of 14700.

Samsung plans to increase the proportion of Exynos processors in the Galaxy S27 series from 25% to 50%. The S27+, S27 Pro, and even S27 Ultra in some markets may use the Exynos 2700. The specific implementation will depend on the supply of the Qualcomm Snapdragon 8 Elite Gen6 Pro.