LG Supports Samsung in Improving the Exynos Chipset

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Samsung

The upcoming Exynos 2600 is a game changer for Samsung, being the first high end chip used in the Galaxy S lineup after a few years. This is Samsung’s strategy to breathe new life into the Exynos brand and reduce its reliance on Qualcomm for flagship chipsets.

Initial report suggest that the Exynos 2600 chipset is shaping up to be a strong contender with early signs of promising performance. Another important factor that could ensure a smooth launch is the high production output coming out of Samsung’s foundry making large scale manufacturing more realistic. Wafer testing an essential part of the semiconductor production process is being managed by LB Semicon, a company with a solid reputation for handling these types of critical quality checks. This partnership adds further confidence that Samsung is on track to deliver a high quality product.

New Developments Indicate Rising Exynos 2600 Output Levels

Semiconductor assembly testing is one of LB Semicon’s key areas of expertise. The company belongs to the LB Group, which is connected to the larger LG conglomerate in South Korea. Reports suggest that Samsung has brought LB Semicon on board as the third company to support wafer testing for the Exynos 2600. To prepare for this responsibility, LB Semicon is said to be moving its equipment into Samsung’s Anseong factory to begin operations.

LB Semicon has some experience working with Samsung on wafer testing, but the work has generally been limited to mid-range Exynos chipsets and the chips produced for Google’s Pixel phones. This will be the first occasion where the company takes on testing responsibilities for a flagship level Exynos processor marking an important step up in its partnership with Samsung.

The main purpose of wafer testing is to check whether each individual chip on a semiconductor wafer is functioning correctly or has defected. This is done by examining the electrical properties of each chip which are determined by the circuits etched into the wafer. After completing wafer testing, a packaging test is performed to ensure that the final chip works properly and meets the performance and reliability standards required for electronic devices.

The Exynos 2600 is undergoing wafer testing with the help of Samsung’s existing partners, Dosantes and Nepass. In addition, Samsung brought in a third testing partner to support the process. This move suggests that the company is preparing to manufacture the chip in large quantities. By involving three separate partners, Samsung can strengthen its quality assurance measures and ensure that the Exynos 2600 delivers consistent performance and reliability across all units.

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