TSMC’s production capacity has confirmed that Apple will not release the iPhone 18 this year.
According to Fast Technology on January 21, multiple sources have previously hinted that Apple’s iPhone 18 series will adopt a “two-times-a-year” release strategy, with different models being launched in two batches.
Specifically, Apple will release the iPhone 18 Pro, iPhone 18 Pro Max and iPhone Fold foldable screen this fall, and the standard iPhone 18 in the spring of 2027.
TSMC’s current WMCM packaging capacity expansion plan provides the strongest evidence for Apple’s phased release strategy. It is understood that TSMC plans to double its WMCM packaging capacity to 120,000 wafers per month by 2027, while in 2026, TSMC’s WMCM packaging capacity was approximately 60,000 wafers per month.
To achieve this goal, TSMC not only upgraded the equipment at its Longtan plant, but also built a new WMCM production line at its AP7 plant in Chiayi. The chip manufacturing giant also joined forces with partners such as ASE and Xintec to jointly undertake wafer sorting and final testing.
According to leaked information, the Apple iPhone 18 series will be the first to feature the A20 and A20 Pro chips, with the standard iPhone 18 being the first to feature the A20 and the iPhone 18 Pro series being the first to feature the A20 Pro.
Both chips use TSMC’s 2nm process, and their packaging technology has been switched from InFO to WMCM. This change means that multiple independent chips such as CPU, GPU, and neural network engine can be integrated into a single package, achieving a new level of flexibility.
This expansion of TSMC’s WMCM production capacity coincides with the launch of the standard version of Apple’s iPhone 18. These types of models usually bring higher sales, which confirms that Apple is indeed going to adopt a phased release strategy for the iPhone 18 series.
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