Blogger Digital Chat Station revealed that the OPPO Find X9 standard version will be the first to be equipped with the Dimensity 9500 chip, equipped with a 6.59-inch four-sided straight screen, the rear main camera is a 50-megapixel 1/1.4-inch large bottom , as well as a periscope telephoto, ultrasonic screen fingerprint, wireless fast charging, full-level waterproof and ultra-large capacity silicon-carbon negative electrode battery.
Compared with the previous generation, the main upgrades of the Find X9 standard version include performance, screen and ultrasonic screen fingerprint. This will be the strongest Dimensity standard version.
In addition, Dimensity 9500 is MediaTek’s flagship Soc to be launched in the second half of the year. This chip is built based on TSMC’s N3P process (TSMC’s third-generation 3nm process) and adopts a new full-large core architecture. The CPU includes 1*Travis+3*Alto+4*Gelas, of which Travis and Alto are Arm’s latest Cortex-X9 series super-large cores, and Gelas is Arm Cortex-A7 series large core.
The phone will be released as early as the end of September, along with the OPPO Find X9 Pro, which is also equipped with the MediaTek Dimensity 9500 flagship platform.
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